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Device Fabrication Facilities

Photolitography System KARL SUSS MJB3

The Karl Suss MJB 3 Mask Aligner is designed for high resolution photolithography in a laboratory, development or pilot production environment. The MJB 3 offers unsurpassed flexibility in the handling of irregular shaped substrates and pieces of differing thickness, as well as standard size wafers up to 3" in diameter. Used with positive and reversible resist, it offers a minumum size of 1 micron. It is placed in a clean yellow room.

Reactive Ion Etching (RIE)

RIE system for selective materials etching:

  • Load Lock for sample charging equipped with rotative pump

  • High Vacuum Aluminum chamber with rotative and turbomolecular pumps

  • 8 inches sample holder

  • 1 kW RF (13.56 MHz) generator for plasma coupling

  • 4 gas inlet control system equipped with needle valve, gas flow meters and MKS

  • Totally controlled by PC, with processes memory​

Sputron (shallow ion implanter)
An Ion Gun Sputtering system by Balzers for thin film coatings

  • High Vacuum Aluminum chamber with rotative and turbomolecular pumps

  • Up to three targets, 3 inches diameter

  • Rotating carousel-like sample holder for homogineous coating

  • 3 kV Ion Gun, optionally for ion shallow implantation

  • 2 gas inlet control system equipped with gas flow meters

  • sample heating system up to 400° C 

Wire Bounder
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